据行业消息,苹果公司即将推出的M5 Pro和M5 Max处理器将突破传统设计框架,采用台积电(TSMC)定制的SoIC-MH封装技术。这一变革标志着苹果首次在MacBook Pro产品线中引入模块化芯片架构,旨在解决现有SoC布局在性能扩展方面的核心痛点。当前M系列芯片采用单芯片集成方案,除内存外所有组件均通过单一制程制造。这种设计虽能保证数据传输效率,但性能提升严重依赖芯片面积扩张。例如M3 ...
Source Link据行业消息,苹果公司即将推出的M5 Pro和M5 Max处理器将突破传统设计框架,采用台积电(TSMC)定制的SoIC-MH封装技术。这一变革标志着苹果首次在MacBook Pro产品线中引入模块化芯片架构,旨在解决现有SoC布局在性能扩展方面的核心痛点。当前M系列芯片采用单芯片集成方案,除内存外所有组件均通过单一制程制造。这种设计虽能保证数据传输效率,但性能提升严重依赖芯片面积扩张。例如M3 ...
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