近年生成式人工智能(Generative AI)与高效运算(HPC)需求持续爆发,推动先进封装一跃成为全球半导体供应链中最关键且最紧张的产能瓶颈。据供应链业内人士透露,台积电南科 AP8 厂区将新增 P2 工厂,两座工厂均以晶圆级系统集成(CoWoS)技术为主;而原本聚焦晶圆级多芯片封装(WMCM)、系统级集成芯片(SoIC)及面板级系统集成封装(CoPoS)的嘉义 AP7 厂区,也将把 SoIC...
Source Link近年生成式人工智能(Generative AI)与高效运算(HPC)需求持续爆发,推动先进封装一跃成为全球半导体供应链中最关键且最紧张的产能瓶颈。据供应链业内人士透露,台积电南科 AP8 厂区将新增 P2 工厂,两座工厂均以晶圆级系统集成(CoWoS)技术为主;而原本聚焦晶圆级多芯片封装(WMCM)、系统级集成芯片(SoIC)及面板级系统集成封装(CoPoS)的嘉义 AP7 厂区,也将把 SoIC...
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