路透旧金山2月10日 - 思科CSCO.O周二发布了一款新型芯片和路由器，旨在加快大型数据中心的资讯传输速度，该产品将与博通 AVGO.O和Nvidia(辉达/英伟达)NVDA.O的产品竞争，以期在价值6,000亿美元的人工智能$(AI)$基础建设支出热潮中分得一杯羹。
思科表示，其 Silicon One G300 交换器芯片预计在今年下半年上市，将能让负责训练与运行 AI 系统的芯片，透过数十万条连结彼此沟通。
思科通用硬件集团执行副总裁Martin Lund在接受路透采访时表示，该芯片将采用台积电2330.TW的3纳米芯片制程制造，并将具有几个新的“减震器”功能，旨在当AI芯片网路遭遇大量数据流量突增时，避免处理速度被拉低。
思科预计，该芯片能让部分 AI 运算工作加快 28%，部分原因是它能在微秒内自动将资料重新导向，绕过网路中的任何问题。(完)
(编审 戴素萍)
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