比亚迪申请功率模块封装结构专利,解决电场集中导致的寄生电容和电感问题

市场资讯
Feb 09

国家知识产权局信息显示,比亚迪股份有限公司申请一项名为“功率模块的封装结构、功率模型及封装方法和用电设备”的专利,公开号CN121487607A,申请日期为2025年9月。专利摘要显示,一种功率模块的封装结构、功率模块及用电设备,所述封装结构包括:封装基板,以及设置所述封装基板上的多个导电区;至少一个所述导电区上设置有功率芯片,所述功率芯片和所述导电区电连接,所述导电区与导电区之间设置有间隔槽,...

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