此前我们曾报道苹果计划与英特尔达成芯片供应协议,在2027年或2028年,让英特尔为非Pro版的iPhone以及Mac和iPad产品线提供芯片代工服务,采用英特尔的EMIB封装。而根据最新的爆料,英特尔又迎来一个大客户,那就是联发科。爆料称联发科将会采用英特尔14A打造天玑系列SoC,不过外媒似乎有些担心英特尔14A先进制程的良率与功耗控制能否如期达标。据了解,英特尔14A直接对标台积电14A工艺...
Source Link此前我们曾报道苹果计划与英特尔达成芯片供应协议,在2027年或2028年,让英特尔为非Pro版的iPhone以及Mac和iPad产品线提供芯片代工服务,采用英特尔的EMIB封装。而根据最新的爆料,英特尔又迎来一个大客户,那就是联发科。爆料称联发科将会采用英特尔14A打造天玑系列SoC,不过外媒似乎有些担心英特尔14A先进制程的良率与功耗控制能否如期达标。据了解,英特尔14A直接对标台积电14A工艺...
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