金吾财讯 | ASMPT(00522)股价强势，截至发稿，报106.4港元，涨5.45%，成交额4.79亿港元。摩根大通发表报告，ASMPT将上调其热压焊接(TCB)设备的长期总潜在市场规模预期，并对于在该市场获得更多市场份额展现信心。同时，公司将提供更多在高频宽存储器(HBM)热压焊接市场的进展，该行指出中国市场及主流外包半导体封装测试厂商的资本开支环境正变得更加有利。
该行将公司2026及27财年每股盈利预测分别上调7%及15%。该行将ASMPT的评级由“中性”上调至“增持”，目标价由76港元上调至125港元，并列入正面催化剂观察名单，基于先进逻辑封装领域强劲的资本支出趋势，以及主流外包半导体封装测试(OSAT)市场出现初步改善迹象。
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