得益于台积电全新的“小外形集成电路”(SoIC)封装技术, M5 Pro 和 M5 Max 有望成为苹果首批采用独立 CPU 和 GPU 模块的SoC ,从而为苹果便携式 Mac 电脑带来更多可能性。从提高良率降低制造成本到获得全新性能水平,这些都是企业转向芯片组设计后能够获得的诸多优势。但如果真是如此,为什么高通至今仍未采用这项技术呢?我们在下文中探讨了一些可能性,但我们也认为,高通最终必然会...
Source Link得益于台积电全新的“小外形集成电路”(SoIC)封装技术, M5 Pro 和 M5 Max 有望成为苹果首批采用独立 CPU 和 GPU 模块的SoC ,从而为苹果便携式 Mac 电脑带来更多可能性。从提高良率降低制造成本到获得全新性能水平,这些都是企业转向芯片组设计后能够获得的诸多优势。但如果真是如此,为什么高通至今仍未采用这项技术呢?我们在下文中探讨了一些可能性,但我们也认为,高通最终必然会...
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