【芯闻前沿】EUV光刻机2026年产能已满!

物理微电子前沿...
Feb 21

最新产业研究指出,2025年至2027年间,全球晶圆厂设备支出总额预计达到1560亿美元,较2022年至2024年阶段显著增长约四成以上。与以往周期性复苏不同,本轮扩张更具结构性特征,AI相关制程与封装技术成为资本开支的核心引擎。多家国际设备龙头已率先释放积极信号。ASML、Applied Materials、Lam Research、Tokyo Electron以及KLA均同步上调资本支出与产能...

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