美银证券发表研报指,预计ASMPT(00522.HK) 从2026年下半年至明后两年将迎来更显著的复苏,认为集团的热压焊接(TCB)设备技术应会被更多不同类型的内存/逻辑芯片制造商所采用。而半导体制造商后端产能扩张和技术规格升级,或能使带动集团售卖更多TCB设备。预计集团未来三年每股盈利将录强劲成长(复合年均增长率超过30%),营收达到周期中段至高点水平,毛利率超过40%,且有关营收是可持续的。...
Source Link美银证券发表研报指,预计ASMPT(00522.HK) 从2026年下半年至明后两年将迎来更显著的复苏,认为集团的热压焊接(TCB)设备技术应会被更多不同类型的内存/逻辑芯片制造商所采用。而半导体制造商后端产能扩张和技术规格升级,或能使带动集团售卖更多TCB设备。预计集团未来三年每股盈利将录强劲成长(复合年均增长率超过30%),营收达到周期中段至高点水平,毛利率超过40%,且有关营收是可持续的。...
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