随着英特尔新一代基于Intel 18A制程的处理器Panther Lake的推出,近期更多关于芯片制造层面的技术细节,包括金属层配置、GAA pitch 参数,以及背面供电(PowerVia)在不同电路区块的实施方式被曝光。曝光的资料显示,Panther Lake 芯片面积约110mm²,逻辑与SRAM 均使用HP(High Performance)cells,未采用HD cells。逻辑单元标示...
Source Link随着英特尔新一代基于Intel 18A制程的处理器Panther Lake的推出,近期更多关于芯片制造层面的技术细节,包括金属层配置、GAA pitch 参数,以及背面供电(PowerVia)在不同电路区块的实施方式被曝光。曝光的资料显示,Panther Lake 芯片面积约110mm²,逻辑与SRAM 均使用HP(High Performance)cells,未采用HD cells。逻辑单元标示...
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