我们都知道光互联的三代技术演进路径：可插拔模块、CPO、OIO。技术脉络已经清楚了，但接下来的问题更关键——在这张地图上，谁站在哪里？理解这个市场，其实只需要一张图。横轴是“光离芯片有多近”，纵轴是“价值链的层级”，从最底层的原材料（Layer 0）一直到最上层的完整系统（Layer 5）。不过，看懂地图和看到地图是两回事。在列公司名字之前，我想先说清楚这个市场里埋着的三个结构性规律。搞明白这三点...
Source Link我们都知道光互联的三代技术演进路径：可插拔模块、CPO、OIO。技术脉络已经清楚了，但接下来的问题更关键——在这张地图上，谁站在哪里？理解这个市场，其实只需要一张图。横轴是“光离芯片有多近”，纵轴是“价值链的层级”，从最底层的原材料（Layer 0）一直到最上层的完整系统（Layer 5）。不过，看懂地图和看到地图是两回事。在列公司名字之前，我想先说清楚这个市场里埋着的三个结构性规律。搞明白这三点...
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