博通近日宣布推出BroadPeak™,这是一款高度集成的射频数字前端(DFE)SoC器件,为5G大规模多输入多输出(MIMO)和远程射频单元(RRH)应用开启了新的可能性,并为下一代5G Advanced和6G无线基础设施铺平了道路。该器件在单芯片上集成了先进的5nm CMOS DFE和ADC/DAC模块,与现有大规模MIMO和RRH解决方案相比,功耗最多可降低40%。凭借突破性的射频性能和从...
Source Link博通近日宣布推出BroadPeak™,这是一款高度集成的射频数字前端(DFE)SoC器件,为5G大规模多输入多输出(MIMO)和远程射频单元(RRH)应用开启了新的可能性,并为下一代5G Advanced和6G无线基础设施铺平了道路。该器件在单芯片上集成了先进的5nm CMOS DFE和ADC/DAC模块,与现有大规模MIMO和RRH解决方案相比,功耗最多可降低40%。凭借突破性的射频性能和从...
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