晶圆代工龙头盘前走强，日月光半导体涨5.6%，联电涨4.2%，台积电涨1.8%，Tower半导体涨1.5%。 消息面上，阿斯麦研究人员宣布，已找到提升核心芯片制造设备光源功率的技术方案，可将EUV光源功率从当前的600瓦提升至1000瓦。更高功率意味着每小时可生产更多芯片，从而降低单颗芯片的制造成本。据介绍，到2030年底，客户单台设备每小时可处理约330片硅晶圆，较当前的220片提高50%。(格隆汇)
晶圆代工龙头盘前走强，日月光半导体涨5.6%，联电涨4.2%，台积电涨1.8%，Tower半导体涨1.5%。 消息面上，阿斯麦研究人员宣布，已找到提升核心芯片制造设备光源功率的技术方案，可将EUV光源功率从当前的600瓦提升至1000瓦。更高功率意味着每小时可生产更多芯片，从而降低单颗芯片的制造成本。据介绍，到2030年底，客户单台设备每小时可处理约330片硅晶圆，较当前的220片提高50%。(格隆汇)
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