导语:AI算力需求持续引爆半导体创新竞赛,先进封装与材料技术成为兵家必争之地。台积电2nm工艺加持博通3D堆叠芯片、稀土供应紧张冲击美航太产业、台达电AI电源产能吃紧延续1-2年……全球供应链正经历结构性重塑。一文速览今日五大关键动向。博通3D堆叠芯片冲刺百万出货博通宣布,凭借3D堆叠芯片技术,目标在2027年实现至少100万颗出货,有望带来数十亿美元营收。该技术通过将两颗芯片垂直堆叠,显著提升...
Source Link导语:AI算力需求持续引爆半导体创新竞赛,先进封装与材料技术成为兵家必争之地。台积电2nm工艺加持博通3D堆叠芯片、稀土供应紧张冲击美航太产业、台达电AI电源产能吃紧延续1-2年……全球供应链正经历结构性重塑。一文速览今日五大关键动向。博通3D堆叠芯片冲刺百万出货博通宣布,凭借3D堆叠芯片技术,目标在2027年实现至少100万颗出货,有望带来数十亿美元营收。该技术通过将两颗芯片垂直堆叠,显著提升...
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