苹果2026年将向台积电采购超1亿片先进芯片

未来半导体
Feb 25

2 月 24日,苹果确认 2026 年将从台积电采购超 1 亿片先进芯片,较 2025 年大幅提升。订单将覆盖4nm、3nm制程,用于 iPhone、Mac 及自研 AI 芯片,成为台积电亚利桑那工厂最大单一客户,独占该厂近 40% 先进产能。苹果正持续推动 “近岸生产 + 先进制程” 深度绑定,强化全球供应链韧性。苹果日前还宣布将部分Mac Mini台式电脑的生产从亚洲转移至美国,这项新的制造...

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