2024年4月，SK海力士与台积电（TSMC）签署了谅解备忘录（MOU），双方就下一代HBM产品生产和加强整合HBM与逻辑层的先进封装技术密切合作。其中台积电负责生产用于HBM4的基础裸片（Base Die），采用N5和N12FFC+工艺。随着HBM定制化时代的到来，基础裸片的生产转移到代工厂，以解决高性能计算中的热量、信号延迟和能效问题。过去这段时间里，SK海力士与台积电展开了密切合作，以...
Source Link2024年4月，SK海力士与台积电（TSMC）签署了谅解备忘录（MOU），双方就下一代HBM产品生产和加强整合HBM与逻辑层的先进封装技术密切合作。其中台积电负责生产用于HBM4的基础裸片（Base Die），采用N5和N12FFC+工艺。随着HBM定制化时代的到来，基础裸片的生产转移到代工厂，以解决高性能计算中的热量、信号延迟和能效问题。过去这段时间里，SK海力士与台积电展开了密切合作，以...
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