博通发布全球首款6G芯片2月19日,博通公司宣布推出一款高集成度射频数字前端(DFE)SoC芯片BroadPeak™,为5G大规模多输入多输出(MIMO)与射频拉远单元(RRH)应用开辟全新可能,并为下一代5G-A(5G Advanced)和6G无线基础设施铺平道路。据悉,该芯片采用5nm先进CMOS工艺,在单芯片上集成了业界顶尖的数字前端(DFE)与ADC/DAC模块,相比现有大规模MIMO和...
Source Link博通发布全球首款6G芯片2月19日,博通公司宣布推出一款高集成度射频数字前端(DFE)SoC芯片BroadPeak™,为5G大规模多输入多输出(MIMO)与射频拉远单元(RRH)应用开辟全新可能,并为下一代5G-A(5G Advanced)和6G无线基础设施铺平道路。据悉,该芯片采用5nm先进CMOS工艺,在单芯片上集成了业界顶尖的数字前端(DFE)与ADC/DAC模块,相比现有大规模MIMO和...
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