博通发布业界首个3.5D面对面计算SoC

蓝鲸财经
Feb 26

蓝鲸新闻2月26日电,博通公司今日宣布已开始出货业内首款基于其3.5D eXtreme Dimension System in Package(XDSiP)平台的2纳米定制计算SoC。作为一个经过验证的模块化、多维堆叠芯片平台,3.5D XDSiP结合了2.5D技术和采用面对面(F2F)技术的3D-IC集成。博通公司表示,3.5D XDSiP 是下一代 XPU 的基础。借助3.5D XDSiP,...

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