算力核心赛道:光通信CPO产业链全解析(附股)

乐晴智库精选
Feb 25

本文重点聚焦算力硬件核心赛道:CPO产业链、竞争格局以及产业趋势。01 CPO概览在光通信领域,CPO共封装光学是当前最受关注的前沿技术之一,其主要目标是通过光电共封装解决AI算力爆发带来的数据传输瓶颈问题。核心在于将激光器、调制器、光接收器等光学器件与ASIC芯片(如交换芯片)通过先进封装技术(如2.5D/3D封装)直接集成在同一封装内。这一设计显著减少了信号传输损耗和延迟,同时降低功耗,成为...

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