△广告与正文无关2月24日,上海证券交易所披露,盛合晶微半导体有限公司(以下简称"盛合晶微")科创板首次公开发行股票申请已通过上市审核委员会审议会议。这意味着这家晶圆级先进封测企业距离登陆A股市场再进一步。据上交所官网信息,上市委在现场问询中重点关注了公司的客户依赖问题。问询要求盛合晶微结合其2.5D业务的技术来源、三种技术路线的应用领域与发展趋势、市场空间,以及新客户开拓情况,说明与主要客户的...
Source Link△广告与正文无关2月24日,上海证券交易所披露,盛合晶微半导体有限公司(以下简称"盛合晶微")科创板首次公开发行股票申请已通过上市审核委员会审议会议。这意味着这家晶圆级先进封测企业距离登陆A股市场再进一步。据上交所官网信息,上市委在现场问询中重点关注了公司的客户依赖问题。问询要求盛合晶微结合其2.5D业务的技术来源、三种技术路线的应用领域与发展趋势、市场空间,以及新客户开拓情况,说明与主要客户的...
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