中芯国际孵化,先进封装又一新股呼之欲出

松果财经
Feb 27

2.5D的现在时与3D的未来式。@松果财经原创春节刚过,科创板迎来首家过会企业。2月24日,上海证券交易所官网披露,盛合晶微半导体有限公司科创板IPO申请已获上市审核委员会审议通过。这家起步于12英寸中段硅片加工、向2.5D/3D多芯片集成封装纵深延展的企业,成为2026年春节后首家过会公司。在摩尔定律逼近物理极限、AI算力需求爆发的当下,先进封装一直以来都不是简单的辅助环节,而是决定系统性能与...

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