当地时间2026年2月26日,美国芯片大厂博通公司宣布,已开始向富士通交付业界首款基于其3.5D超大尺寸系统级封装(XDSiP)平台打造的2纳米定制计算SoC。3.5D XDSiP是一个成熟的模块化多维堆叠芯片平台,它结合了2.5D技术和采用面对面(F2F)技术的3D集成电路集成。3.5D XDSiP 是下一代 XPU 的基础。借助 3.5D XDSiP,消费级 AI 客户能够交付最先进的 XPU...
Source Link当地时间2026年2月26日,美国芯片大厂博通公司宣布,已开始向富士通交付业界首款基于其3.5D超大尺寸系统级封装(XDSiP)平台打造的2纳米定制计算SoC。3.5D XDSiP是一个成熟的模块化多维堆叠芯片平台,它结合了2.5D技术和采用面对面(F2F)技术的3D集成电路集成。3.5D XDSiP 是下一代 XPU 的基础。借助 3.5D XDSiP,消费级 AI 客户能够交付最先进的 XPU...
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