建滔系早盘上扬,截至发稿,建滔积层板(01888)涨4.72%,报24.68港元;建滔集团(00148)涨2.37%,报41.3港元。消息面上,据上证报引述产业界最新消息,日本半导体材料巨头Resonac(力森诺科)已于3月1日起,上调CCL(铜箔基板)及粘合胶片价格30%。业界预期,Resonac的提价将传导至MLCC(铜箔基板)、HDI板(高密度互连板)、IC载板、高频高速PCB等高端制造环节...
Source Link建滔系早盘上扬,截至发稿,建滔积层板(01888)涨4.72%,报24.68港元;建滔集团(00148)涨2.37%,报41.3港元。消息面上,据上证报引述产业界最新消息,日本半导体材料巨头Resonac(力森诺科)已于3月1日起,上调CCL(铜箔基板)及粘合胶片价格30%。业界预期,Resonac的提价将传导至MLCC(铜箔基板)、HDI板(高密度互连板)、IC载板、高频高速PCB等高端制造环节...
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