据报阿斯麦(ASML)计划将芯片制造设备扩展至先进封装领域

金吾财讯
Mar 02

金吾财讯 | 据媒体报道,阿斯麦(ASML)计划利用人工智能提高工具性能和生产速度,计划将芯片制造设备扩展至先进封装领域,计划研发工具以帮助将多个芯片拼接在一起。

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