苹果芯片大改!Pro/Max系列首次采用双拼架构,AI算力最高翻4倍

DeepTech深科技
Mar 04

3 月 3 日,苹果发布两款新芯片:M5 Pro 和 M5 Max。这两颗芯片和之前的 M 系列最大的区别在于,使用了一种叫做融合架构的新设计,把两个独立的芯片晶粒封装到了一起。一个芯片晶粒负责 CPU 和输入输出,另一个芯片晶粒专门管图形。两个芯片晶粒之间使用“高速桥梁”连接,看起来就像一块完整的芯片,延迟也非常低。(来源:苹果)苹果说,得益于这个设计和更高的统一内存带宽,M5 Pro 和 ...

Source Link

Disclaimer: Investing carries risk. This is not financial advice. The above content should not be regarded as an offer, recommendation, or solicitation on acquiring or disposing of any financial products, any associated discussions, comments, or posts by author or other users should not be considered as such either. It is solely for general information purpose only, which does not consider your own investment objectives, financial situations or needs. TTM assumes no responsibility or warranty for the accuracy and completeness of the information, investors should do their own research and may seek professional advice before investing.

Most Discussed

  1. 1
     
     
     
     
  2. 2
     
     
     
     
  3. 3
     
     
     
     
  4. 4
     
     
     
     
  5. 5
     
     
     
     
  6. 6
     
     
     
     
  7. 7
     
     
     
     
  8. 8
     
     
     
     
  9. 9
     
     
     
     
  10. 10