天岳先进:公司将以超大尺寸技术及产品为支点,持续深耕碳化硅半导体材料的蓝海市场

证券日报
Mar 02

  证券日报网讯 3月2日,天岳先进在互动平台回答投资者提问时表示,公司严格遵守商业保密协议,具体客户合作细节以客户官方披露为准。截至目前,公司已与全球前十大功率半导体器件制造商中一半以上的制造商建立了业务合作关系,客户主要采用公司高品质的碳化硅衬底制造功率器件及射频器件,最终用于电动汽车、AI数据中心以及光伏系统等领域。未来,随着碳化硅行业全面迈入“12英寸新时代”,公司将以超大尺寸技术及产品为支点,持续深耕碳化硅半导体材料的蓝海市场。通过推动产品大尺寸化、生产效率提升的双轮驱动,助力客户持续降低碳化硅衬底的规模化使用成本,推动碳化硅衬底在更多应用场景加速应用。

(文章来源:证券日报)

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