Canon Joins Japan-Funded Project for Next-Gen Semiconductor Design Tech Development

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Canon (TYO:7751) said it is participating in Japan's New Energy and Industrial Technology Development Organization project for next-generation semiconductor design technology, according to its statement on Tuesday.

The project involves developing an advanced image processing system on chip (SoC) technology for post-5G applications.

The initiative will combine Canon's imaging expertise with software developer Nihon Synopsys' design capabilities for SOCs that use 2nm process technology and chiplet integration to achieve high-performance, low-power solutions for edge devices.

This project aligns with Canon's broader commitment to advancing domestic semiconductor capabilities, as demonstrated by its recent investment in semiconductor giant Rapidus.

Canon, alongside 31 other Japanese companies, invested in Rapidus' 267.6 billion yen funding round on Feb. 27.

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