台积电先进封装布局2026台积电2026年先进封装布局兼顾海内外拓展与技术迭代,核心围绕CoWoS、SoIC、InFO等关键技术展开。海外方面,其先进封装实现首发,将通过与Amkor合作,利用亚利桑那厂于2026年提供在地封装服务,同时已申请许可在美国亚利桑那凤凰城、日本熊本兴建首座先进封测厂,暂无具体整体计划。台湾本土厂区各有侧重:龙潭厂持续供应苹果iPhone处理器封装,首条CoPoS实验线...
Source Link台积电先进封装布局2026台积电2026年先进封装布局兼顾海内外拓展与技术迭代,核心围绕CoWoS、SoIC、InFO等关键技术展开。海外方面,其先进封装实现首发,将通过与Amkor合作,利用亚利桑那厂于2026年提供在地封装服务,同时已申请许可在美国亚利桑那凤凰城、日本熊本兴建首座先进封测厂,暂无具体整体计划。台湾本土厂区各有侧重:龙潭厂持续供应苹果iPhone处理器封装,首条CoPoS实验线...
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