高通在2026年世界行动通讯大会(MWC 2026)上发表新一代旗舰穿戴式芯片骁龙穿戴平台至尊版,采用3nm制程,首度将至尊版品牌引入可穿戴领域,主打端侧AI、大幅效能跃升与多元连接能力,宣示让智能手表等装置具备在本地端运行大型模型的能力。高通指出,骁龙穿戴平台至尊版整合升级版CPU与GPU,采用全新5核心CPU架构。与前代平台相比,CPU单执行绪效能最高提升5倍,GPU最高FPS效能提升可达7倍,并提供多达10TOPS的AI算力,可支援在装置端运行参数规模达20亿的AI模型。这也是高通迄今最先进的个人AI穿戴式平台。
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