智通财经APP获悉，建滔系早盘上扬，截至发稿，建滔积层板(01888)涨4.72%，报24.68港元；建滔集团(00148)涨2.37%，报41.3港元。
消息面上，据上证报引述产业界最新消息，日本半导体材料巨头Resonac(力森诺科)已于3月1日起，上调CCL(铜箔基板)及粘合胶片价格30%。业界预期，Resonac的提价将传导至MLCC(铜箔基板)、HDI板(高密度互连板)、IC载板、高频高速PCB等高端制造环节。此外，PCB即将迎来超级催化剂——英伟达LPU推理芯片。
万联证券表示，算力加速发展推动AI PCB技术升级，提升高多层板及HDI等高端PCB需求。我国PCB行业产值全球领先，国内主流PCB厂商资本开支加速，积极扩充HDI、高多层板等高端PCB产能。上游材料中，覆铜板有望受益于PCB扩产需求，由于原材料价格上涨叠加需求旺盛，近期CCL产品持续涨价，有望推动企业盈利能力提升。
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