先进封装成破局,博通率先落地3.5D,6000mm²超大集成

电子发烧友
Mar 02

电子发烧友网报道(文/莫婷婷)在全球AI算力需求呈指数级爆发、传统摩尔定律逐渐失效的背景下,先进封装技术成为突破算力瓶颈的关键钥匙。就在近日,博通(Broadcom)宣布已开始向客户交付业界首款基于其3.5D超大尺寸系统级封装(XDSiP)平台打造的2纳米定制计算SoC。随着博通新品的交付,3.5D时代也加速到来。重新定义维度:什么是3.5D XDSiP?先进封装技术包括2.5D集成和3D集成等。...

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