麦格理发表报告指出,ASMPT(00522.HK) 管理层将热压焊接(TCB)的总目标市场(TAM)预测大幅上调至2028年达16亿美元,意味着从2025年的7.59亿美元起,复合年增长率为30%,高于此前预测的2027年达10亿美元。更新的总目标市场反映了人工智能逻辑及高带宽内存投资的迅速加速。管理层对20H高带宽内存表示乐观,并相信若JEDEC标准持续放宽,热压焊接技术可支援这些堆叠。此外,...
Source Link麦格理发表报告指出,ASMPT(00522.HK) 管理层将热压焊接(TCB)的总目标市场(TAM)预测大幅上调至2028年达16亿美元,意味着从2025年的7.59亿美元起,复合年增长率为30%,高于此前预测的2027年达10亿美元。更新的总目标市场反映了人工智能逻辑及高带宽内存投资的迅速加速。管理层对20H高带宽内存表示乐观,并相信若JEDEC标准持续放宽,热压焊接技术可支援这些堆叠。此外,...
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