博通3.5D XDSiP平台发力,2nm定制芯片交付富士通助力AI计算新突破

ITBEAR科技资讯
Mar 01

在半导体技术领域,一项具有里程碑意义的创新成果正式问世。美国芯片巨头博通公司宣布,成功向富士通交付了全球首款基于3.5D超大尺寸系统级封装(XDSiP)平台的2纳米定制计算SoC。这一突破性技术标志着芯片封装领域迈入全新阶段,为人工智能与高性能计算提供了前所未有的硬件支持。3.5D XDSiP平台作为下一代XPU的核心架构,通过融合2.5D封装技术与面对面(F2F)3D集成电路集成方案,实现了信号...

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