美银证券发表研报指，ASMPT管理层在2025年第四季业绩电话会议上提供乐观的指引，包括热压焊接(TCB)设备的增长前景，以及基于在逻辑及HBM领域的稳固地位，目标取得35%至40%的市场份额。旨在更聚焦先进封装或热压焊接的重组计划亦获充分讨论，但未公布具体时间表。 该行认为，ASMPT很可能转型为一家销售更多热压焊接设备的纯先进封装设备公司。分析显示，热压焊接约占2025年半导体解决方案销售的25%，但预期到2028年将占比超过50%。该行重申对ASMPT的“买入”评级，并在上调2026至2027年每股盈测后，将目标价由150港元上调至160港元。
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