摩根士丹利发表研报指，ASMPT管理层预期今年首季半导体解决方案(Semi)及表面组装技术(SMT)业务的新增订单将按季增长20%，按年增长40%，有望创下过去4年来的季度新高，为今年实现收入增长逾两成提供稳固支持。虽然高订单量部分源于物料交付期延长，但客户需求仍然非常强劲。 受惠于主流半导体及先进封装两大领域的强劲封测代工(OSAT)资本开支，该行认为公司处于有利位置，将目标价上调8%至130港元，重申“增持”评级；将2026及2027年每股盈利预测分别下调9%及6%，主要因汽车及工业市场需要疲弱导致毛利率预测较低。
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