国家知识产权局信息显示,特斯拉公司申请一项名为“具有定向锁定结构的半导体封装件”的专利,公开号CN121621054A,申请日期为2024年6月。专利摘要显示,本公开涉及一种半导体封装件。半导体封装件包括半导体管芯、模制材料和导电结构。导电结构至少部分与半导体管芯堆叠,导电结构包括围绕半导体管芯的点定位的多个槽。多个槽被配置为均衡在半导体管芯的操作期间围绕半导体管芯的点的热应力,其中热应力关联于...
Source Link国家知识产权局信息显示,特斯拉公司申请一项名为“具有定向锁定结构的半导体封装件”的专利,公开号CN121621054A,申请日期为2024年6月。专利摘要显示,本公开涉及一种半导体封装件。半导体封装件包括半导体管芯、模制材料和导电结构。导电结构至少部分与半导体管芯堆叠,导电结构包括围绕半导体管芯的点定位的多个槽。多个槽被配置为均衡在半导体管芯的操作期间围绕半导体管芯的点的热应力,其中热应力关联于...
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