联发科SerDes渡江战役:2025年的AI芯片咽喉要道之争

芯流智库
Mar 08

【摘要】2025年,全球SerDes与定制芯片市场的战局进入白热化。博通在 2025 年春季发布了200G/lane速率的第三代共封装光学CPO产品,巩固其行业领先地位。联发科则在2025年第二季度财报中,解读会上公布了其AI ASIC战略规划,并重申其SerDes互连技术作为核心能力之一。一场旨在颠覆由博通和英伟达构建的旧有秩序的技术渡江战役,已经进入关键的中盘阶段。以下是正文:01SerDes...

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