3月10日,应用材料宣布与美光科技合作,整合应用材料EPIC研发中心和美光创新中心的研发能力,开发下一代DRAM、高带宽内存(HBM)和NAND存储技术。此次合作还包括开发先进封装技术,以实现高带宽、低功耗的内存解决方案。
Source Link3月10日,应用材料宣布与美光科技合作,整合应用材料EPIC研发中心和美光创新中心的研发能力,开发下一代DRAM、高带宽内存(HBM)和NAND存储技术。此次合作还包括开发先进封装技术,以实现高带宽、低功耗的内存解决方案。
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