【光大海外】公司交流:ASMPT基本面更新&4Q25业绩解读

EBoversea
Mar 12

观点聚焦全球封装设备龙头,受益于先进封装产能扩产与投资加码SMT和主流半导体设备订单复苏,26Q1订单预计破四年新高AI核心业务TCB设备出货加速,未来哪些新增订单值得期待?公司业务重构,NEXX、SMT业务出售如何影响公司发展?【主持人】付天姿 光大研究所所长助理 海外组首席分析师【嘉宾】Lee总 ASMPT高级投资者关系经理【参会人】董馨悦 海外TMT分析师【会议时间】3月13日(周五)15:...

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