英特尔先进封装,强势崛起

半导体芯闻
Mar 09

如果您希望可以时常见面,欢迎标星 收藏哦~人工智能(AI)芯片需求快速攀升,使半导体产业的先进封装技术成为关键环节。市场传出,因台积电先进封装CoWoS产能长期吃紧,部分AI芯片客户开始评估其他方案,英特尔主打的EMIB封装技术因此受到关注。外媒近日报导指出,相关合作案规模上看每年数十亿美元,显示先进封装市场竞争正逐渐升温。根据Wccftech等外媒报导指出,随着AI运算需求持续扩大,高效能芯片...

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