苹果美产芯片,难掩短板

半导体产业纵横
Yesterday

公众号记得加星标⭐️,第一时间推送不会错过。苹果首款美国制造芯片未能达到预期效果,被指需要到中国台湾地区进行先进的芯片封装。2月下旬,苹果公司表示,其首批美国制造的芯片将在台积电位于亚利桑那州的工厂增产,预计到2026年产量将超过1亿颗。但这一说法可能只部分属实,因为苹果在亚利桑那州生产的硅晶圆必须运往中国台湾地区进行先进的芯片封装。苹果公司最初表示愿意提供澄清,但随后拒绝就此事向EE Times...

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