OFC 2026前瞻:硅光子与CPO如何重塑下一代AI互联体系

华尔街见闻
Mar 12

光互联正成为AI基础设施最关键的瓶颈与机遇。 随着OFC 2026展会即将于本月在洛杉矶开幕,全球光通信产业链将集中展示下一代连接技术的最新进展。在AI数据中心带宽需求的强力驱动下,800G光模块正从试点走向主流,1.6T产品已进入量产爬坡阶段,光互联技术路线正经历一场结构性变革。 据SemiVision Research分析,生成式AI模型规模快速扩张,数据中心核心瓶颈正从晶体管性能转向互联带宽...

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