GLOBALFOUNDRIES publishes presentation on silicon photonics and co-packaged optics for AI data centers

Reuters

Mar 11

GLOBALFOUNDRIES publishes presentation on silicon photonics and co-packaged optics for AI data centers

GlobalFoundries released an investor presentation focused on silicon photonics and advanced packaging for AI data center applications. The presentation cites estimates of about 24,000 EB of annual global wide area network AI traffic in 2030, up about 100% versus 2025. It also cites about 1,000 TWh of annual data center electricity consumption in 2030, up about 100% versus 2025. GlobalFoundries outlines co-packaged optics as an approach to increase optical bandwidth and reduce latency by integrating optical engines with compute and switch silicon. The presentation references its silicon photonics manufacturing footprint in Malta, New York, and Singapore.

Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. GLOBALFOUNDRIES Inc. published the original content used to generate this news brief on March 10, 2026, and is solely responsible for the information contained therein.

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