全球 AI 算力风向标 —— 英伟达 GTC 2026(3 月 16–19 日)前瞻引爆高端 PCB 需求。市场预期其将发布 Rubin、Rubin Ultra 及 Feynman 三大新架构,并推出 LPU 推理平台,直接带动52 层 M9+q 嵌埋 PCB、20–30 层 HDI 板需求爆发。核心数据显示:单块 LPU 平台 PCB 价值达传统服务器的 5–7 倍,单机柜 PCB 价值量提升超...
Source Link全球 AI 算力风向标 —— 英伟达 GTC 2026(3 月 16–19 日)前瞻引爆高端 PCB 需求。市场预期其将发布 Rubin、Rubin Ultra 及 Feynman 三大新架构,并推出 LPU 推理平台,直接带动52 层 M9+q 嵌埋 PCB、20–30 层 HDI 板需求爆发。核心数据显示:单块 LPU 平台 PCB 价值达传统服务器的 5–7 倍,单机柜 PCB 价值量提升超...
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