天风郭明𫓹:英伟达下一代Rubin平台启动新材测试,PCB升级周期将至

华尔街见闻
Mar 13

英伟达新一代AI服务器平台的供应链布局正在加速推进,新一轮PCB材料升级周期的轮廓逐渐清晰。 据天风国际证券分析师郭明𫓹最新供应链调查,英伟达已与PCB厂商就下一代覆铜板(CCL)材料M10启动测试,目标应用涵盖Rubin Ultra及Feynman平台的正交背板与交换刀片主板。 若测试进展顺利,M10 CCL及PCB有望于2027年下半年进入量产阶段。 此次M10测试还引入两家CCL供应商参与,...

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