证券之星消息，根据天眼查APP于3月11日公布的信息整理，广州广合科技股份有限公司基石投资轮融资，融资额1.90亿美元，参与投资的机构包括CPE源峰，景林投资，惠理基金，霸菱亚洲，瑞银集团，瀚亚投资，大湾区共同家园发展基金，MY Asian Opportunities Fund，大家人寿，工银投资。 广合科技(广州)有限公司是一家印制电路板生产企业，致力于高端优质PCB产品制作，目前主要产品有超高速服务器板、大数据存储器用线路板、高频混压板、多阶HDI板、物联网模块类、安防类线路板等，产品广泛应用于通信、计算机及服务器、汽车电子、医疗等领域，并行销北美、欧洲、亚太等国际及地区。数据来源：天眼查APP为证券之星据公开信息整理，由AI算法生成(网信算备310104345710301240019号)，不构成投资建议。
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