IC设计大厂联发科持续深化边缘AI与物联网布局,在全球嵌入式技术盛会Embedded World 2026宣布,扩大全球生态系合作版图,不仅携手AI龙头英伟达(NVIDIA),亦纳入AI软硬整合业者撷发科,另外,研华、仁宝、微星等台厂作为硬体供应商,共同打造从芯片、AI模型到系统整合的完整技术平台,推动AI从云端走向边缘端与实体世界。领先业界以台积电3纳米制程打造AIoT平台,联发科物联网助理...
Source LinkIC设计大厂联发科持续深化边缘AI与物联网布局,在全球嵌入式技术盛会Embedded World 2026宣布,扩大全球生态系合作版图,不仅携手AI龙头英伟达(NVIDIA),亦纳入AI软硬整合业者撷发科,另外,研华、仁宝、微星等台厂作为硬体供应商,共同打造从芯片、AI模型到系统整合的完整技术平台,推动AI从云端走向边缘端与实体世界。领先业界以台积电3纳米制程打造AIoT平台,联发科物联网助理...
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