当地时间3月16日,据报道,美光科技表示,其HBM4产线已于今年第一季度开始量产并出货,首批产品为36GB的12层堆叠(12-high)版本,专为Vera Rubin平台打造。该公司表示,HBM4相比上一代HBM3E提升约2.3倍,同时功耗效率提升超过20%。
当地时间3月16日,据报道,美光科技表示,其HBM4产线已于今年第一季度开始量产并出货,首批产品为36GB的12层堆叠(12-high)版本,专为Vera Rubin平台打造。该公司表示,HBM4相比上一代HBM3E提升约2.3倍,同时功耗效率提升超过20%。
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