三星在英伟达 GTC 大会上首次展示下一代 AI 芯片 HBM4E

环球市场播报
10 hours ago

  三星电子英伟达 GTC 大会上首次展示了这款芯片,突显了其成为英伟达即将推出的 Vera Rubin 平台关键合作伙伴的努力。三星还展示了 Hybrid Copper Bonding(混合铜键合),这是一种旨在克服传统热压键合物理限制的新封装技术。HCB 技术可让新一代高带宽存储器(HBM)实现16 层及以上堆叠,同时将热阻降低20% 以上。其他为英伟达 AI 基础设施打造的前沿技术还包括HBM4与SOCAMM2,目前这两款产品均已量产。

海量资讯、精准解读,尽在新浪财经APP

责任编辑:王永生

Disclaimer: Investing carries risk. This is not financial advice. The above content should not be regarded as an offer, recommendation, or solicitation on acquiring or disposing of any financial products, any associated discussions, comments, or posts by author or other users should not be considered as such either. It is solely for general information purpose only, which does not consider your own investment objectives, financial situations or needs. TTM assumes no responsibility or warranty for the accuracy and completeness of the information, investors should do their own research and may seek professional advice before investing.

Most Discussed

  1. 1
     
     
     
     
  2. 2
     
     
     
     
  3. 3
     
     
     
     
  4. 4
     
     
     
     
  5. 5
     
     
     
     
  6. 6
     
     
     
     
  7. 7
     
     
     
     
  8. 8
     
     
     
     
  9. 9
     
     
     
     
  10. 10