【券商聚焦】招银国际:半导体行业行业并未走向单一技术路线

金吾财讯
Yesterday

金吾财讯 | 招银国际表示,2026年光纤通信展会(OFC)印证了行业结构性变革:AI算力扩张,推动数据中心互联架构在光、电领域全面重构。会议聚焦共封装光学(CPO)与可插拔光模块的技术路线争议、LPO/NPO等中间架构崛起、XPO全新形态面世、光电路交换机(OCS)作为配套方案关注度持续提升。行业并未走向单一技术路线,而是持续丰富互联方案,以满足算力扩容、横向扩展及系统效率的多元需求。在此背景下,可插拔光模块仍为核心主流方案,单通道400G持续迭代、供应链明朗化、模块设计与散热方案不断升级,均支撑其核心地位。

Disclaimer: Investing carries risk. This is not financial advice. The above content should not be regarded as an offer, recommendation, or solicitation on acquiring or disposing of any financial products, any associated discussions, comments, or posts by author or other users should not be considered as such either. It is solely for general information purpose only, which does not consider your own investment objectives, financial situations or needs. TTM assumes no responsibility or warranty for the accuracy and completeness of the information, investors should do their own research and may seek professional advice before investing.

Most Discussed

  1. 1
     
     
     
     
  2. 2
     
     
     
     
  3. 3
     
     
     
     
  4. 4
     
     
     
     
  5. 5
     
     
     
     
  6. 6
     
     
     
     
  7. 7
     
     
     
     
  8. 8
     
     
     
     
  9. 9
     
     
     
     
  10. 10